Use in electrical and electronic equipment

AuthorClemm, Christan; Löw, Clara; Baron, Yifaat; Moch, Katja; Möller, Martin; Köhler, Andreas R; Gensch, Carl-Otto; Deubzer, Otmar
Pages13-21
RoHS Annex II Dossier, final
Indium phosphide
13
3 USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT
Indium phosphide is employed in a wide variety of devices, products, and applications. Due to its
semiconductor and photovoltaic properties, indium phosphide is used in a wide array of applications
in optoelectronic devices, displays, high-speed electronics and photovoltaics. Typical applications of
InP include e.g.:13
Lasers, photo detectors and modulators used for global telecommunication networks;
Spectroscopic analysers and LiDAR (Light Detection And Ranging) applications;
High Electron Mobility Transistors (HEMT) and Heterostructure Bipolar Transistors (HBT) for high-
speed electronic devices;
Semiconductor quantum dots (QD) as a colour converting component of liquid crystal display
backlit devices;
Substrate for photovoltaic cells.
3.1 Function of the substance
As compared to other semiconductor materials such as silicon and gallium arsenide (GaAs), indium
phosphide is generally characterised by superior electrical and thermal properties, higher electron
mobility, higher frequency as well as higher thermal conductivity.
In optoelectronic appliances, InP-based active material produces light emission, detection, or
modulation at wavelengths compatible with low dispersion or low loss in optical fibres, which enables
much higher data rates (for a given distance) or much longer distances (for the same data rate) than
can be achieved with other materials, like e.g. GaAs. Consequentially, the wafers have low power
consumption and a low noise performance.14
With these functionalities, indium phosphide is considered to be the enabling semiconductor material
for high power and/or high frequency performance electronic components and for various
functionalities of optoelectronic devices. In these devices InP, as the gain medium15 of generating
infrared light, is responsible for the emission wavelength of laser chips and the detection wavelength
of the photo-diodes at 1.30 m or 1.50 m ranges. The wavelength windows are determined by the
minimum absorption windows of silica which is the key material of optical fibres used in
telecommunications networks.16 17
13 References are included in sections 2.1 and 2.2
14 T&M Coalition (2018), Contribution of Test / Measurement Coalition submitted on 15.06.2018 during the stakeholder
consultation conducted from 20 April 2018 to 15 June 2018 by Oeko-Institut in the course of the study to support the
review of the list of restricted substances and to assess a new exemption request under RoHS 2 (Pack 15);
http://rohs.exemptions.oeko.info/fileadmin/user_upload/RoHS_Pack_15/1st_Consultation_Contributions/Contribution
_TMC_7_Substances_response_20180615_fin.pdf, last viewed 20.12.2018
15 A gain medium is a medium which can amplify the power of light (typically in the form of a light beam), which is needed
in a laser in order to compensate for the resonator losses.
16 Coherent (2018), Contribution of Coherent submitted on 12.06.2018 during the stakeholder consultation conducted
from 20 April 2018 to 15 June 2018 by Oeko-Institut in the course of the study to support the review of the list of
restricted substances and to assess a new exemption request under RoHS 2 (Pack 15);
http://rohs.exemptions.oeko.info/fileadmin/user_upload/RoHS_Pack_15/1st_Consultation_Contributions/Contribution
_Coherent_Indium_phosphide_Stakeholder_Response_20180612.pdf, last viewed 20.12.2018;
17 3SPT (2018), Contribution of 3SPT submitted during the stakeholder consultation conducted from 20 April 2018 to 15
June 2018 by Oeko-Institut in the course of the study to support the review of the list of restricted substances and to
assess a new exemption request under RoHS 2 (Pack 15);
http://rohs.exemptions.oeko.info/fileadmin/user_upload/RoHS_Pack_15/1st_Consultation_Contributions/Contribution
_3SPT_Technologies_InP_1st_Stakeholder_Consultation_InP_3SPT_Participation.pdf, last viewed 20.12.2018

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